TSMC is looking to explore a revolutionary route in semiconductors by developing “advanced chip packaging” using rectangular substrates. TSMC’s New Wafer Design Concept Might Be What The Future AI Markets Would Need With the rapidly growing AI sector, the need for higher computational power has become more important than ever. While the industry employs techniques such as node shrinking and architectural gains, opting for innovative and new routes has become a necessity, and it looks like the Taiwan giant is doing just that. Nikkei Asia reports that TSMC is moving towards employing rectangular panel-like substrates, moving away from conventional wafer […]
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