South Korean memory manufacturer SK hynix has signed an agreement with the US government under the bipartisan CHIPS and Science Act to receive as much as $450 million in subsidies to develop advanced packaging facilities in America. This funding comes just as the global packaging industry experiences a supply crunch due to high demand for AI products. SK hynix makes advanced memory products for AI GPUs and other products, and today’s announcement adds to the firm’s $3.87 billion investment in building a memory packaging facility in Indiana. SK hynix Scoops Up $450 Million In US Funding To Developed Advanced Chip […]
Read full article at https://wccftech.com/sk-hynix-wins-450-million-us-funding-to-make-latest-ai-memory-chips-in-america/
