Investment bank Morgan Stanley believes that the Taiwan Semiconductor Manufacturing Company (TSMC) will be able to expand its CoWoS chip packaging capacity a year ahead of schedule. TSMC was initially slated to grow its packaging capacity by 2026, but as per the bank, this has moved ahead by a year to 2025. Packaging demand has grown in the wake of the AI wave and has been one of the key constraints in the industry, which has ordered hundreds of thousands of GPUs primarily from NVIDIA Corporation. Morgan Stanley’s optimism is also reflected in its share price target for TSMC, which […]
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