The U.S. trade sanctions on Huawei pretty much mean the latter is fighting an uphill battle with other chipmakers, as it lacks access to the latest and greatest in EUV equipment. Fortunately, a new report states that later this year, when the Mate 90 series materializes, the former Chinese giant will finally show to the world that its use of DUV machinery is sufficient to mass produce competitive chipsets, with the upcoming Kirin SoC said to match TSMC’s 3nm process. Unproven LogicFolding could carve out Huawei’s future, but previous Kirin SoCs were also similarly hyped Both SMIC and Huawei have […]
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