U.S. memory chip maker Micron Technology announced today a new package called uMCP5. The latter is the industry’s first UFS multi-chip package featuring low-power LPDDR5 RAM. The chip is a “combination of high-performance, high-density, low-power memory and storage in one compact package.” The use of LPDDR5 RAM means that features found on flagship handsets can be used on high-end phones. According to Micron, these features include “image recognition, advanced artificial intelligence (AI), multicamera support, augmented reality (AR) and high-resolution displays.” The new chip is now available …
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