SK Hynix, one of the leading manufacturers of DRAM memory, recently entered Intel’s compatibility verification process for DDR5 memory for server-side use with their upcoming DRAM standard, reports the Korean news site Chosun Biz. This next step for the company is one step closer to the mass production of new products, especially for server-based DRAM.
SK Hynix is presently waiting for compatibility verification for the company’s new DRAM with Intel
SK Hynix will be waiting for complete compatibility verification from Intel on the company’s new 10nm class fifth-generation server DRAM. Next month, the verification process will begin to see if the new DRAM can be utilized in Intel’s server processors. This was announced during the company’s conference call last month, where the company was quoted as stating, “We will complete preparations for mass production of 1b DRAM in the middle of this year.”
With Intel maintaining a ninety-percent stabilization of the server processor marketplace, SK Hynix hopes their new DRAM will be utilized with Intel’s processors to see full use in servers, such as data centers. The company also achieved the first 10nm class fourth-generation server DRAM while Intel also presented its new Intel Xeon Scalable Processors, also known as Sapphire Rapids. When asked for a comment, a representative declined any recent collaboration with other companies.
SK Hynix’s next step in their business plan is to launch a 1ß nano DRAM that will see production in the future. The new DRAM increases efficiency by forty percent compared to the company’s competition with a higher cost.
Samsung Electronics, another leader in the memory industry, recently launched a 16 GB DDR5 DRAM that utilized the 1ß nano process. The company that Samsung chose to complete compatibility verification with was Intel’s CPU competitor AMD.
Recently, it was revealed that DRAM manufacturers such as SK Hynix and Samsung have increased pricing on memory solutions, including HBM. NVIDIA had asked SK Hynix to increase its HBM3 production capacity for the company. However, other vendors are looking to integrate HBM3 within their next-gen products, such as Intel. This would cause SK Hynix not to be able to maintain demand for their products. That being said, the pricing of HBM3 memory has seen an increase of up to five times its original costs.
Currently, SK Hynix and rival Samsung Electronics are the only capable institutions that can manufacture computer components with the newer Extreme Ultraviolet (EUV) lithography process.
The post SK Hynix Next-Generation 10nm DRAM Begins Intel’s DDR5 Verification Tests by Jason R. Wilson appeared first on Wccftech.
