Huawei defying the U.S. sanctions and proceeding to mass produce the 7nm Kirin 9000S for a range of flagships is regarded as a miracle by industry watchers, but that does not mean that the road ahead is going to be any easier. A former TSMC Vice President of Research And Development who is also known for inventing immersion lithography is regarded as a ‘chip guru’ in the latest report, and he states that fabricating a 5nm chipset on the existing DUV equipment is going to be highly expensive, but doable. Using DUV machinery to mass produce a 5nm silicon requires […]
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