SK hynix has announced its partnership with TSMC for the development of next-gen HBM4 memory and packaging technologies such as CoWoS 2. SK hynix Enters The HBM4 Memory Race: Partners With TSMC For Next-Gen Memory & Packaging Innovations The announcement from SK hynix comes just a day after Samsung announced that it has kicked of its very own HBM4 memory development and eyes release in 2025. In that regard, the company will be ready with HBM4 by 2026 for official volume release and we can expect them to also feature some extravagant speeds with higher memory capacities achieved through using […]
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