Well, forget chip shrinking and focus on interposer advancements. TSMC has implemented this by unveiling enormous plans for the next generation of SoW packaging. TSMC Sees Next-Gen “SoW” Chip Packaging As a Crucial Factor To Progress Into the Future, Making Chips Bigger Than Ever! Before diving into what TSMC has disclosed, let’s talk about interposers. Imagine a chip in your hand. Well, it’s a powerful one if you assume it. Now, if you are eager to harness more capabilities out of a single chip, instead of going the innovation route, the industry slaps multiple chips and connects them against each […]
Read full article at https://wccftech.com/tsmc-to-scale-up-chips-bigger-packages-system-on-wafer-sow-technology/
