China’s largest semiconductor manufacturing firm, SMIC, has reportedly achieved a new milestone and too, without the use of advanced EUV machinery that gives companies like Samsung and TSMC an edge in the cutting-edge chipmaking space. The latest information claims that using DUV equipment, the 5nm process has been completed, and SMIC is ready to mass produce the first batch of wafers. Huawei was previously said to be working closely with its local foundry partner to introduce a new Kirin SoC that will be found in the upcoming Mate 70 series for October later this year. No word on yields, but […]
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