Samsung is all set to launch its cutting-edge “SAINT” 3D packaging services next year, which are targeted at next-gen HBM4 memory production. Samsung’s “SAINT” 3D Packaging Tech To Offer Vertical Stacking, Ensuring Significant Performance & Efficiency Bumps For Next-Gen HBM4 Memory Standard Well, it looks like the Korean giant is looking to excel in the AI industry through new and advanced offerings. Now, Samsung aims to excel in the HBM segment through its next-gen 3D packaging services. According to a report by the Korea Economic Daily, Samsung is all set to provide 3D packaging services by 2025, which is expected […]
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