TSMC’s advanced manufacturing processes is creating steep bills for its partners, which perfectly explains why Apple was the only one to introduce its A17 Pro and M3 on the 3nm ‘N3B’ node last year. The second-generation 3nm process, which is also known as ‘N3E,’ does not hold back on footing a large sum for companies like Qualcomm and MediaTek, but at least with its improved yields paired with performance and efficiency upgrades, companies would be more encouraged to transition to the cutting-edge technology. The first Android chipsets mass produced on this lithography will be the Dimensity 9400 and Snapdragon 8 […]
Read full article at https://wccftech.com/dimensity-9400-unit-price-20-percent-higher-thanks-to-tsmc-3nm-n3e-process/
