The partnership between Apple and TSMC has enabled both companies to bring out the best when it comes to cutting-edge chips. The Cupertino firm not only attempts to remain ahead of the competition by investing in advanced nodes such as 3nm, but it is also exploring other packaging technologies such as 3DFabric with its foundry partner. Now, according to one rumor, Apple is exploring SoIC (Small Outline Integrated Circuit) packaging, which can bring a multitude of benefits to the table, so let us check out all the details here. A small-scale pilot test of SoIC packaging is rumored to be underway, […]
Read full article at https://wccftech.com/apple-exploring-using-tsmc-soic-packaging-for-future-chipsets/
