NVIDIA’s Blackwell AI GPUs are expected to lift every other associated segment, including CoWoS (TSMC) & HBM DRAM, as the market expects millions of chips to be shipped by 2025. HBM and Chip Packaging Industry To Witness Tremendous Growth Over The Next Year Thanks To NVIDIA’s Blackwell AI GPUs, Huge Amounts To Ship In 2025 TrendForce reports that the latest NVIDIA Blackwell GPUs for AI are poised to be the industry’s next “holy grail” since the performance they are bringing to the markets has attracted the attention of several major clients. This includes the GB200 SUPERCHIP, which is projected to […]
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