Samsung has announced the development of its next-gen HBM4 memory which will debut in 2025 with some grand specs and features. Samsung’s Next-Gen HBM4 Memory To Offer Increased Capacities, Increased Speeds & Should Utilize 3D Packaging Technology In a blog post by the Korean semiconductor manufacturer, Samsung once again reaffirmed that its HBM4 memory is currently in development and should debut in 2025. The company’s current HBM portfolio includes the HBM3E “Shinebolt” as the top offering, featuring up to 36 GB capacities using 24 Gb DRAM and up to 9.8 Gbps transfer speeds. The memory technology supports stacks up to […]
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