Samsung looks to excel in DRAM standards, as the firm is preparing “3D DRAM” that aims to stack higher cell layers for big capacity boost. Samsung’s Next-Gen 3D DRAM Could Potentially Take Chip Capacities Up To 100 GB, Providing High-Performance With the DRAM industry in dire need of innovation, the Korean giant has stepped in with its new concepts to attract consumer and clientele interest. At the International Memory Workshop (IMW) 2024 event held in Seoul, South Korea, Samsung Electronics Vice President Lee Si-woo showcased the new 3D DRAM technology, claiming that with rapidly growing markets, especially the AI segment, […]
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