Apple introduced its first family of second-generation 3nm chipsets for the iPhone 16 series, the A18 and A18 Pro, last month, bringing in a wave of improvements over last year’s A17 Pro. Despite featuring the same 6-core CPU and only being separated by a single GPU core, the latest die shot comparison reveals that a single difference can result in reconfiguring various clusters, as you will soon find out. TSMC utilized its InFO-POP packaging for the A18 and A18 Pro, reducing the overall die size by ensuring strong thermal and electrical performance An in-depth analysis was performed by Chipwise that […]
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