Taiwan giant TSMC will receive the first batch of high-NA EUV lithography equipment from ASML by the end of 2024, marking the transition to next-gen processes. TSMC Decides To Switch Towards High-NA Equipment Amid Market Competition, Will Likely Utilize It With A14 & Ahead Processes The utilization of high-NA equipment is now seen as something “premium” for chipmakers, and it looks like the big “three” players in the semiconductor race, Samsung, Intel, and TSMC, are all looking to get their hands on ASML’s high-NA equipment. Interestingly, initially, it was said that TSMC doesn’t have plans to acquire ASML’s high-NA technology, […]
Read full article at https://wccftech.com/tsmc-to-recieve-asml-high-na-euv-equipment-end-of-year-costing-350-million/
