TSMC is reportedly “rushing” towards improving CoWoS production as the immense demand from the markets starts to gobble up the whole supply chain. TSMC Faces Massive Demand For Its Packaging Technology From The AI Markets, Leading To a Supply Chain Bottleneck For those unaware, TSMC’s CoWoS advanced packaging plays a crucial role in the development of an AI accelerator, which is why, since the start of the AI frenzy, the technology has been in massive demand. The Taiwan giant has been upscaling its production on a monthly basis now, and despite large-scale efforts, TSMC is still unable to fulfill the […]
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