Korean memory manufacturer SK hynix won $458 million in funding through the CHIPS Act earlier today to build a memory packaging facility in Indiana. Semiconductor packaging has emerged as a key bottleneck for production, particularly in US-based chip production. SK hynix’s new plant will focus on memory packaging, and along with the $458 million in direct funding, the firm will also be able to rely on $500 million in additional loans for the new sites. SK hynix HBM Memory Facility In Indiana Expected To Commence Production In 2028 Along with Micron, whose shares have tanked by 18% today after yesterday’s […]
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