The memory modules in Huawei’s latest data center chip, the Kunpeng 930, appear to have been manufactured with TSMC’s N5 manufacturing node. TSMC started mass producing products with the N5, or 5nm, technology in 2020, and the latest memory chips are built with the N3 node, with N2 expected to enter the fray soon. However, with the N5 bitcell being roughly similar to the N3 bitcell size, it’s unclear whether Kunpeng lags behind the latest chips at least in this aspect. Huwei’s Latest Data Center Chip, The Kunpeng 930, Might Not Be As Outdated Over Western Counterparts As Previously Thought […]
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