Infinix creates a “3D Vapor Cloud Chamber”, which improves on conventional designs by 3°C

Infinix has developed an improved vapor chamber cooling system that it calls “3D Vapor Cloud Chamber” (3D VCC). Compared to conventional designs, it reduces the temperature of the chipset by 3°C, according to the company.

The way it does this is by improving the contact between the chipset and the vapor chamber itself. Phone VCs are typically flat, which requires the use of thermal paste (or a similar material) to mate the chipset and VC.

The 3D VCC design has a “bump” that leaves only the tiniest gap between the chamber and the chipset. The bump has an additional advantage – it…