New packaging technologies have been employed by TSMC to further improve the attributes of chipsets that have been mass produced on its first-generation 3nm process and newer. The Taiwanese giant’s Small Outline Integrated Circuit Molding-Horizontal packaging, or SoIC-MH, aims to improve thermal and electrical performance, leading to a better ‘performance per watt’ rating from SoCs. Unfortunately, while it is exciting to hear Apple has reportedly commenced mass production of its M5, this packaging might not be applied to the latter and could debut in the M5 Pro instead. The lack of efficiency improvements by jumping from 3nm ‘N3E’ and 3nm […]
Read full article at https://wccftech.com/apple-could-adopt-tsmc-soic-mh-packaging-to-the-m5-pro/
