Intel CEO Lip-Bu Tan Might Save Firm’s Glass Substrate Packaging Business Through An Investment From Samsung, Says Report

OSTN Staff

Intel logo in gold on a black background, symbolizing innovation in technology.

Tech giant Samsung’s chairman Lee Jae-Yong is visiting the US, and insiders in the Korean industry speculate that his visit could lead to an investment in beleaguered chip manufacturer Intel’s packaging business. Intel’s shares rose last week after the US government announced a 10% stake in the firm, and the sources believe that Samsung’s investment will seek to bolster the firm’s competitive position versus TSMC due to the latter’s significant packaging investments to cater to AI demand. Samsung Chairman To Likely Announce Investment In Intel As Part Of US Trip Intel and TSMC are the only high-end chip manufacturers in […]

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