NVIDIA’s next-gen Rubin AI architecture will reportedly feature the company’s first SoIC packaging, followed by Apple and TSMC has apparently started preparing for it. TSMC’s SoIC Will Likely Replace CoWoS In Terms of Market Hype; Taiwan Giant Estimates Massive Demand With the debut of Team Green’s Rubin architecture, we’ll likely witness the next revolution in the hardware segment of the market, given that with the lineup, NVIDIA plans to not only revamp the architectural design but integrate industry-leading components such as HBM4. In a report by Ctee, it is claimed that TSMC has started to rapidly build facilities in Taiwan […]
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